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Fender Rumble Club

#61,161
dORSY said:
mosfets are just linear gain devices. until You implement class D switching.... and so You've implemented the Integrated Circuit.
I'm pretty sure there must be implementations where switching is not integrated, as for why the hack would anyone do that, dunno. Makes no sense to me.
(see the same pattern as class AB vs class G/H?)
You could go down to atomic levels or beyond and find out that everything is just the same in our world :D
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In the context of high power amplifiers, if you're calling a PCB and solder that includes an actual IC and high power discrete transistors an IC, then I think you have lost track of your narrative, in your desire to be right.

If they are not GaN-based transistors then the silicone-based transistors that are on actual IC's are too small to handle the heat produced in high power amplifiers.
 
#61,162
John D Harris said:
In the context of high power amplifiers, if you're calling a PCB and solder that includes an actual IC and high power discrete transistors an IC, then I think you have lost track of your narrative, in your desire to be right.

If they are not GaN-based transistors then the silicone-based transistors that are on actual IC's are too small to handle the heat produced in high power amplifiers.
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isnt this 600W class D chip an IC? am I missing something?
1771928678683.png

or this? (rumble100)
1771928889440.png


r800 PCB w/ multiple chips:
FYI:
"you can bridge two Class D amp channels (or chips) to create a Bridge-Tied Load (BTL) configuration. This technique is commonly used to increase power output by delivering roughly double the voltage to the speaker."
"Instead of "bridging" to increase voltage, you can sometimes "parallel" two bridged chips to increase current capacity. This is known as PBTL mode, which allows the amp to drive much lower impedance speakers safely."

The latter gives You thousands of Watts at low impedance (2Ohms or less). That's how big PA systems are configured to achieve huge setups.
 
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#61,163
dORSY said:
isnt this 600W class D chip an IC? am I missing something?
View attachment 7439619
or this? (rumble100)
View attachment 7439620
FYI:
"you can bridge two Class D amp channels (or chips) to create a Bridge-Tied Load (BTL) configuration. This technique is commonly used to increase power output by delivering roughly double the voltage to the speaker."
"Instead of "bridging" to increase voltage, you can sometimes "parallel" two bridged chips to increase current capacity. This is known as PBTL mode, which allows the amp to drive much lower impedance speakers safely."

The latter gives You thousands of Watts at low impedance (2Ohms or less). That's how big PA systems are configured to achieve huge setups.
Click to expand...
No, and 100W is not a high power amp (these days).

TI makes three IC's that do produce 600W (TPA3255 / TPA3255D2 / TAS5634), but that is the max of any IC that I've run across.

For higher power, you need either discrete MOSFET's or GaN-based transistors (which are made in both discrete and IC formats).
 
#61,164
John D Harris said:
No, and 100W is not a high power amp (these days).

TI makes three IC's that do produce 600W (TPA3255 / TPA3255D2 / TAS5634), but that is the max of any IC that I've run across.

For higher power, you need either discrete MOSFET's or GaN-based transistors (which are made in both discrete and IC formats).
Click to expand...
have You seen the r800 pcb? :D how much watts is high power to You? (2 readily publicly available consumer TI chips is already 1.2kW @parallel. note that multi-kW amps don't have one output rail, but multiple... practically we don't push kilowatts into one cable. makes no sense. at least for audio applications.)
with 90%+ efficiency, dissipating 0-50-100W of heat from an IC chip is not a big deal at all. (a silicon computer chip can make 10X that heat already)
 
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#61,166
dORSY said:
have You seen the r800 pcb? :D how much watts is high power to You? (2 readily publicly available consumer TI chips is already 1.2kW @parallel. note that multi-kW amps don't have one output rail, but multiple... practically we don't push kilowatts into one cable. makes no sense. at least for audio applications.)
with 90%+ efficiency, dissipating 0-50-100W of heat from an IC chip is not a big deal at all. (a silicon computer chip can make 10X that heat already)
Click to expand...
The R800 power‑amp PCB is built around a discrete‑transistor output stage rather than an integrated‑circuit (IC) driver.
Typical implementations use complementary MOSFETs (or bipolar transistors) in a bridge or push‑pull configuration, with a small control IC (often a driver or bias‑generation chip) handling the timing and bias but not providing the main power amplification.

The TI chips with that power rating are not designed for audio amplifiers, but are intended for consumer‑grade products such as high‑power adapters, EV‑charging front‑ends, and high‑current desktop power supplies.
 
#61,167
John D Harris said:
The R800 power‑amp PCB is built around a discrete‑transistor output stage rather than an integrated‑circuit (IC) driver.
Typical implementations use complementary MOSFETs (or bipolar transistors) in a bridge or push‑pull configuration, with a small control IC (often a driver or bias‑generation chip) handling the timing and bias but not providing the main power amplification.

The TI chips with that power rating are not designed for audio amplifiers, but are intended for consumer‑grade products such as high‑power adapters, EV‑charging front‑ends, and high‑current desktop power supplies.
Click to expand...
Never mind, he needs to be right. There are people like that. They cannot accept facts that are being presented. Unfortunately this behavior is on the rise.
 
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#61,169
John D Harris said:
The R800 power‑amp PCB is built around a discrete‑transistor output stage rather than an integrated‑circuit (IC) driver.
Typical implementations use complementary MOSFETs (or bipolar transistors) in a bridge or push‑pull configuration, with a small control IC (often a driver or bias‑generation chip) handling the timing and bias but not providing the main power amplification.

The TI chips with that power rating are not designed for audio amplifiers, but are intended for consumer‑grade products such as high‑power adapters, EV‑charging front‑ends, and high‑current desktop power supplies.
Click to expand...
You are talking about TI chips that are used in Rumbles... i'm out :)
Can You show us the r800 PCB circuit diagram that shows Your statement? Or? :) I wanna see facts. (instead of LLM copypastas)
 
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#61,173
Ryeguy63 said:
In case anyone is interested, Fender is now offering deluxe padded covers for some of the Rumble combos. You can check them out on the official Fender site.
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Would it be too much to ask of Fender to put a pocket on their covers to store the power chord like other manufactures do? Being there is no place on my 500 amp to store it? :mad:
 
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#61,174
Ryeguy63 said:
In case anyone is interested, Fender is now offering deluxe padded covers for some of the Rumble combos. You can check them out on the official Fender site.
Click to expand...
Looks like they're available for Rumble 100 and 200/500/800.
They also expanded their lineup of standard covers, which are now available not just for Rumble 100 and 200/500/800, but also for 1×15, 2×10 and 4×10 cabs (I didn't realize Fender made a 410 cab, so I guess it's something new).
dORSY said:
Is this "example" used in Rumbles? :rolleyes:
(What's "DIGITAL" in a mosfet? :D other than marketing bullsh*t)
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All modern processors are CMOS, I'm not sure if IBM's mainframe books are still made with bipolar ECL logic.
DWA2469 said:
Would it be too much to ask of Fender to put a pocket on their covers to store the power chord like other manufactures do? Being there is no place on my 500 amp to store it? :mad:
Click to expand...
I guess you can sew a pocket on the side?
 
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#61,175
DWA2469 said:
Would it be too much to ask of Fender to put a pocket on their covers to store the power chord like other manufactures do? Being there is no place on my 500 amp to store it? :mad:
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I totally agree. That was the first thing I looked for when I reading the description, I thought for sure they would include a pocket. Both of my Custom covers have them. It saves me from having to carry an extra bag for power cords, extension cab cords.etc.
 
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#61,177
Ryeguy63 said:
In case anyone is interested, Fender is now offering deluxe padded covers for some of the Rumble combos. You can check them out on the official Fender site.
Click to expand...

Wow, guy!! You're right! And the 200/500/800 padded cover is just $99.99!

Invalid Link Removed

They also still have some of the less expensive unpadded covers!
 
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#61,178
dORSY said:
Is this "example" used in Rumbles? :rolleyes:
(What's "DIGITAL" in a mosfet? :D other than marketing bullsh*t)
Click to expand...
May I remind you
dORSY said:
That is bullsh$t talk. Class D needs/has no transistors. If You bought one with'em, it's not Class D. So IDK what the point is here.

…
Click to expand...
This is what the argument was about. Making fun of things and asking about Rumbles doesn‘t make your statement valid. Your statement is false on very many levels.
 

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